Course Website: http://www.soe.ucsc.edu/classes/ee115/Fall05/

Access to this directory is allowed from on-campus (within UCSC domains--*.ucsc.edu), or else requires this username and password:

username: ee115

password: truck31 
 

Syllabus: 
 

1. Introduction and Overview (Kovacs Chapter 1) (video Powers of Ten)
   1. What are MEMS? (Kovacs 1.1-1.4)
      1. There’s plenty of room at the bottom [Feynman] http://arri.uta.edu/acs/jmireles/MEMSclass/Feynman_There's_Plenty_of_Room_Below.pdf
      2. Infinitesimal Machinery [Feynman]
      3. Principles of MEMS [Janusz Bryzek]
      4. Silicon as a Mechanical Material [Petersen] http://arri.uta.edu/acs/jmireles/MEMSclass/Petersen_Si_as_a_Mechanical_Material.pdf
      5. Sensor History http://www.allsensors.com/history/SensorHistory.pdf
   2. Why MEMS? (Kovacs 1.5)
      1. Scaling and performance
      2. Cost reduction
      3. Complexity
   3. Issues to consider (Kovacs 1.6)
   4. MEMS Markets (Kovacs 1.7)
   5. Overview of MEMS applications
   6. Information resources (Kovacs 1.8)
      1. On-line resources
      2. Conferences
      3. Journals
      4. Textbooks
      5. Collections
      6. Patents
2. Micromachining Techniques – Overview (Kovacs 2.1-2.4) (video Silicon Run)
   1. Capabilities and limitations of micromachining (Kovacs 2.1)
   2. Materials for micromachining (Kovacs 2.2)
      1. Substrates (Kovacs 2.2.1)
      2. Additive films and Materials (Kovacs 2.2.2)
   3. Micromachining terms (Kovacs 2.3)
   4. General properties of common semiconductors (Kovacs 2.4) Materials Properties http://parts.jpl.nasa.gov/docs/JPL%20PUB%2099-1D.pdf
      1. Mechanical properties (Kovacs 2.4.1)
      2. Native oxides of silicon (Kovacs 2.4.2)
      3. Typical silicon wafer types (Kovacs 2.4.3)
   5. Micromachining Techniques – Bulk Micromachining (Kovacs 2.5) (Kovacs et al., “Bulk Micromachining of Silicon”, Proceedings of the IEEE, Vol. 86, No. 8, p. 1536 (1998)).
   6. Wet etching of silicon (Kovacs 2.5.1)
      1. Isotropic etching (HNA)( Kovacs 2.5.1.1)
      2. Anisotropic etching (V-MOS) (Kovacs 2.5.1.2)
         1. EDP (Hydrazine)
         2. KOH
         3. TMAH
         4. Etch stop layers
         5. Masking
         6. Mask erosion around edges
   7. A bulk micromachining process flow (handout)
   8. Electrochemical etching (Kovacs 2.5.3)
      1. Etch stop (Kovacs 2.5.3.1)
      2. Porous silicon (Kovacs 2.5.4)
      3. One-sided wafer etching (Kovacs 2.5.5.5)
   9. Vapor phase etching (XeF₂) (Kovacs 2.5.6.1)
   10. Dry etching (Kovacs 2.5.7)
       1. SF₆
       2. DRIE (Kovacs 2.5.7.2)
          1. Bosch process
          2. Cryogenic dry etching
          3. Sidewall roughness
          4. Etch lag
   11. Combined isotropic and anisotropic dry etching (Kovacs 2.5.7.3)
       1. SCREAM
       2. ASIP
3. Micromachining Techniques – Surface Micromachining (Kovacs 2.6)

Bustillo et al., “Surface Micromachining for Microelectromechanical Systems”, Proceedings of the IEEE, Vol. 86, No. 8, p. 1552 (1998)]

D. Koester et al, “PolyMUMPS Design Handbook”, Rev. 11., Chapter 1, http://www.memsrus.com/documents/PolyMUMPs.DR.v11.pdf

P. J. French and P. M. Sarro, “Surface versus bulk micromachining: the contest for suitable applications”, J, Micromech. Microeng. 8, pp. 45-53 (1998).

1. Thin film processes
   1. Oxide (thermal, deposited LTO)
   2. Nitride (stoichiometric, low-stress)
   3. Poly (stress, stress-gradients)
   4. Metal
2. A surface micromachining process flow
3. Release (Kovacs 2.8)
   1. Wet–Stiction (Kovacs 2.8.1)
   2. Dry
      1. Critical point drying (Kovacs 2.8.1.1)
      2. Vapor HF (Kovacs 2.8.2.3)
4. Microelectronic integration
   1. Prior
   2. Mixed
   3. Post
5. Electro-deposition (Kovacs 2.6.3)

4. Hybrid Micromachining Process: NIST ATP proposal

[Kubby et al., "Hybrid integration of light emitters and detectors with SOI based Micro-Opto-Electro-Mechanical Systems (MOEMS)"] http://www.infotonics.org/Newsroom/documents/HybridSOIMEMSProcess.pdf

1. Wafer bonding (Kovacs 2.7)
   1. Anodic bonding (Kovacs 2.7.1)
   2. Fusion bonding (Kovacs 2.7.2) Reading Schmidt, “Wafer to Wafer bonding for microstructure formation”, Proceedings of the IEEE, Vol. 86, No. 8, p. 1575 (1998)
2. SOI wafers
   1. SIMOX
   2. BESOI
   3. Smart-cut
3. Process modules
   1. Bulk Micromachining
   2. CMP
   3. Surface Micromachining

5. Guest Lecture: David Burns “MEMS Design, Process Development and Manufacturing Methodology” (10/06/05).

6. Layout/CAD/Modeling D. Koester et al, “PolyMUMPS Design Handbook”, Rev. 11., Chapter 2.  http://www.memsrus.com/documents/PolyMUMPs.DR.v11.pdf
   1. Layout (L-Edit)
      1. Technology files
      2. Cross-sections
      3. Drawing
   2. Example cells and layouts
   3. Design rules
   4. Design Techniques (IntelliSuite)
      1. MEMS physical layout
      2. Solid modeling and 3-D tools
      3. 3-D analysis
      4. MEMS simulation
      5. MEMS optimization principles
   5. Lab: Anisotropic Etch Simulation (IntelliSuite training manual chapter 16)
7. Micro-Mechanics (Kovacs Chapter 3, 5)
   1. Basic Mechanics (Kovacs 3.2)
      1. Axial stress & strain (Kovacs 3.2.1)
      2. Shear stress & strain (Kovacs 3.2.2)
      3. Poisson’s Ratio (Kovacs 3.2.3)
   2. Commonly used deflection equations (Kovacs 3.2.4)
      1. Static beam equations (Kovacs 3.2.4.1)
      2. Static torsion equations (Kovacs 3.2.4.2)
      3. Static plate equations (Kovacs 3.2.4.3)
   3. “Beam Theory Blah.”  http://robotics.eecs.berkeley.edu/~pister/245/2001F/Notes/Beams-L.pdf

“Mechanical Structures.” http://www.dyu.edu.tw/~da/Teaching/MEMS/Handouts/mems-08-structures.pdf

1. Cantilever beams
2. Clamped-clamped beams
3. Membranes
4. Springs
   1. Folded
   2. Torsional
4. Dynamics (Kovacs 3.2.5)
   1. md²x/dt² + bdx/dt + kx = F(t)
   2. Ld²q/dt² + Rdq/dt + (1/C)q = E(t)
   3. Transforms
   4. Resonance
   5. Dampening
5. Test structures (Kovacs 3.3), http://parts.jpl.nasa.gov/docs/JPL%20PUB%2099-1I.pdf
   1. Elastic properties
      1. Bent Beam Method for determining Young’s modulus
      2. Resonant beam structures
         1. Cantilever beam
         2. Comb drive resonator
   2. Stress/Strain Gauges
      1. Bent beam strain sensor
      2. Cantilever beams
      3. Buckling beam structures
      4. Substrate analysis; Stoney Equation
6. Basic mechanisms and structures Kovacs (3.4)
   1. In-plane rotary mechanisms (Kovacs 3.4.1)
   2. Out-of-plane mechanisms (Kovacs 3.4.2)
   3. Structural members (Kovacs 3.4.3)
   4. Bistable mechanisms (Kovacs 3.4.4)
   5. Self-assembly (Kovacs 3.4.5)
7. Mechanical Sensors (Kovacs 3.5)
   1. Resistive and piezoresistive strain sensors (Kovacs 3.5.1.1)
   2. Semiconductor strain gauges
   3. Capacitive sensing (Kovacs 3.5.1.4)
8. Micromachined mechanical sensors
   1. Accelerometers (Kovacs 3.5.2.2)
      1. Basic accelerometer concepts
      2. Force-balanced accelerometer concepts
      3. Strain guage accelerometers
      4. Capacitive accelerometers
   2. Gryoscopes (Kovacs 3.5.2.3)
   3. Pressure sensors (Kovacs 5.2.4)
      1. Piezoresistive pressure sensors
      2. Capacitive pressure sensors

8. Micro-mechanics Lab: Crash sensor, piezo beam, pressure sensor (IntelliSuite training manual chapter 8,9,10)

9. Electrostatics (Kovacs 3.6)
   1. Actuation mechanisms (Kovacs 3.6.1)
   2. Electrostatic actuation (Kovacs 3.6.1.1)
      1. Parallel plate actuators
      2. Torsional electrostatic actuators
      3. Electrostatic comb drives
      4. Electrostatic cantilever actuators
      5. Electrostatic linear micromotors (scratch drive)
      6. Electrostatic rotary micromotors
   3. Mechanical circuit components
      1. Mechanical resonators (Kovacs 3.7.1.1)
      2. Cantilever resonators (Kovacs 3.7.1.2)
      3. Lateral resonators (Kovacs 3.7.1.3)
   4. Mechanical test structures (M-Test structures) Reading: Peter M. Osterberg and Stephen D. Senturia, “M-Test: A test chip for MEMS material property measurement using electrostatically actuated test structures”, J. Microelectromechanical Systems, Vol. 6, No. 2, p. 107 (1997).
10. Electrostatics Lab: Comb drive, RF Switch (IntelliSuite training manual chapters 2,3,6)
11. Design Proposals
12. Midterm Exam (covers weeks 1-5)
13. Optical MEMS (Kovacs 4)
    1. Reflective light modulators (Kovacs 4.3.2.2)
       1. Electrostatic reflective light modulator
       2. Westinghouse mirror matrix tube
       3. Silicon cantilever
       4. Torsion mirror (TI DMD)
       5. Deformable grating
       6. Electrostatic membrane
    2. Micromachined optical structures (Kovacs 4.4)
       1. Fiber-optic couplers (Kovacs 4.4.1)
       2. Reflective components (Kovacs 4.4.2)
       3. Transmissive components (Kovacs 4.4.3)
          1. Waveguides (Kovacs 4.4.3.1)
          2. R-OADM
          3. Refractive lenses (Kovacs 4.4.3.2)
          4. Diffractive lenses
    3. Filters and spectrometers (Kovacs 4.4.4)
       1. Interference filters (Kovacs 4.4.4.1)
       2. Fabry-Perot filters (Kovacs 4.4.4.2)
       3. Fabry-Perot spectrometer (Kovacs 4.4.4.4)
    4. Integrated optical systems (Kovacs 4.5)
       1. Integrated free-space systems (Kovacs 4.5.1)
       2. Waveguide optical systems
    5. MEMS deformable mirrors  http://bifano.bu.edu/tgbifano/Web/BMC_Mirror_Files/15_Opt_Eng_MEMDMs.pdf and http://bifano.bu.edu/tgbifano/Web/BMC_Mirror_Files/14_Opt_Eng_ContDMs.pdf
       1. Parallel plate actuators
       2. Comb drive actuators
14. Optical MEMS Lab: Electrostatically actuated micro-mirror (IntelliSuite training manual chapter 7)
15. Thermal MEMS (Kovacs 6)

John M Maloney, David S Schreiber and Don L DeVoe, “Large-force electrothermal linear micromotors”, J. Micromech. Microeng. 14, pp. 226–234 (2004).

1. Basic Terms (Kovacs 6.2.1)
2. Modes of heat transfer (Kovacs 6.2.2)
   1. Conduction (Kovacs 6.2.2.1)
   2. Convection (Kovacs 6.2.2.2)
   3. Radiation (Kovacs 6.2.2.3)
3. Thermal actuators (Kovacs 3.6.1.2)
   1. Thermal expansion of solids
   2. Bimorph thermal actuators
   3. Bent beam actuators
   4. Thermal array actuators
   5. DiElectric loss heating of thermal bimorphs
   6. Volume expansion and phase-change actuators
4. Thermal sensors (Kovacs 4.2.3.2)
   1. Bolometers
   2. Uncooled bolometers
   3. Air flow sensor

16. Thermal MEMS Lab: Switch activated by Joule heating (IntelliSuite training manual chapter 5)

17. Fluidic MEMS (Kovacs 9)
    1. Introduction (9.1)
       1. Basic fluid properties and equations (Kovacs 9.1.1)
       2. Types of flow (Kovacs 9.1.2)
       3. Bubbles and particles in microstructures (Kovacs 9.1.3)
       4. Capillary forces (Kovacs 9.1.4)
       5. Fluidic resistance (Kovacs 9.1.5)
       6. Fluidic capacitance (Kovacs 9.1.6)
       7. Fluidic inductance (Kovacs 9.1.7)
    2. Flow channels (Kovacs 9.2)
       1. Bulk micromachined channels (Kovacs 9.2.1)
       2. Surface micromachined channels (Kovacs 9.2.2)
    3. Valves (Kovacs 9.5)
       1. Passive valves (Kovacs 9.5.1)
       2. Active valves (Kovacs 9.5.2)
    4. Pumps (Kovacs 9.6)
       1. Bubble pumps (Kovacs 9.6.1)
       2. Membrane pumps (Kovacs 9.6.2)
       3. Diffuser pumps (Kovacs 9.6.3)
       4. Rotary pumps (Kovacs 9.6.4)
       5. Electrohydrodynamic pumps (Kovacs 9.6.5)
       6. Electrophoretic pumps (Kovacs 9.6.6)
    5. Droplet generators
    6. Integrated chemical analysis systems (Kovacs 9.10)
       1. Scaling issues for chemical analysis (Kovacs 9.10.1)
       2. Gas chromatography systems (Kovacs 9.10.2)
       3. Liquid chromatography systems (Kovacs 9.10.3)
       4. Electrophoresis systems (Kovacs 9.10.4)
       5. Cell fusion devices (Kovacs 9.10.5)
       6. DNA amplification (PCR) systems (Kovacs 9.10.6)
18. Fluidic MEMS Lab: Squeeze film dampening, mixer, electrokinetic fluid flow IntelliSuite training manual chapter 11, 14, 15).
19. Package & Test (Maluf Chapter 6)
    1. Mechanical
    2. Electrical
    3. Optical
    4. Thermal
    5. Fluidic
    6. Wafer level packaging
    7. Testing
       1. Probe station
       2. Drive electronics
       3. Stroboscopic imaging
20. Final Design Review (12/01/05)

Grading

Homework: 20%

Midterm: 20%

Final:  20%

Project: 40% 
 

Design Challenge 
 

• Proposal: A short (2 page) written report describing your team’s proposal for the design challenge.  The project goal should be a Micro-Electro-Mechanical System that demonstrates the benefits of scaling (e.g. increased surface to volume ratio allows the micro-robot to walk on water).  The report should start with a literature review and bibliography covering prior work in the area followed by a description of what your team will do.  The proposal will be due when your group gives their oral report on 10/27/05.
• Oral report on design: 30 minute/team oral presentation on 10/27/05.
  • The idea
  • Underlying governing equations showing the benefits of scaling (e.g. surface to volume ratio scales as 1/r)
  • A spreadsheet showing the design space
  • Preliminary design in either Power Point, L-Edit or IntelliSuite
• Design review:  In class on 12/01/05.  We will have participation from external reviewers.  Your project layouts should be very close to completion at this point since you will be turning them in the next day.
• Layout submission:  Final date for submitting layouts will be on Friday 12/2/05.  After this date I will start assembling the individual layouts into an integrated die layout for submission to MUMPS fabrication run #70.
• Final report: Comprehensive report (~10 pages) with:
  • Introduction describing the idea and related work in the literature.  Please include a solid model of your device.
  • Design goals and fabrication principles with a basic analysis (e.g. analytical and/or finite element modeling) to support the design decisions
  • Test structures to verify performance of subcomponents of the system
  • Expected results describing expected performance of test structures and the micro-electro-mechanical system
  • Description of how you will test the design once it has been fabricated
  • Conclusions